Faaluaina itu o le apamemea copper mo HDI
●Mafiafia: 12um 18um 35um 70um
●Matutua lautele: 1290mm, e mafai ona tatou tipiina o le tele o manaoga
●ID: 76 mm, 152 mm
●Umi: masani
●Faʻataʻitaʻiga e mafai ona sapalai; Taimi o le taimi: 7days
●Taimi momoli: 15-20days
●Puleaina o faʻamatalaga: Tuʻufaʻatasiga pusa laupapa
●Taimi: Fob, Cif.
●Tupe totogi: 50% T / T Teuina, paleni totogi ao le i lafoina.
●Maualuga le faʻatinoga o le faʻagaioiga o le tuʻuina atu o mea faigaluega e faʻatino ai le faʻapipiʻi o le apamemea o apamemea.
●Lua-itu masani conpper apamemea
●Ma le maualuga fusi malosi i le laminate
●Faatonutonuina o le tele-vaega lamination
●Lelei tele
●O le ata lelei e piniki
●Mullalayer Lolomiina Crimation Cormit Board
●HDI (maualuga maualuga interconnectactor) mo PCB
Faʻavasegaina | Iunite | Manaoga | Suʻega metotia | ||||||
FOI LE FAAFETAI |
| T | H | 1 | 2 | IPC-4562a | |||
E leai | um | 12 | 18 | 35 | 70 | IPC-4562a | |||
Vaitaimi o Vaitaimi | g / m² | 107±5 | 153± 7 | 285 ± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
Amio mama | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
Rmanogi | Shiny itu (ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
Matte itu (RZ) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
Malosi le malosi | RT (23 ° C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
H.T. (180° C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
Faasolosolo | RT (23 ° C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
H.T. (180° C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
Tetee | Ωng /m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
Fofo malosi (FR-4) | S itu | N / mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
Lbs / i | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
M autafa | N / mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
Lbs / i | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
Pintholes & porosity | Numeras | No | IPC-TM-650 2.1.2 | ||||||
Aneti-povi | RT (23 ° C) | Aso | 180 | / | |||||
H.T. (200° C) | Minute | 40 | / |
Laʻasaga lautele, 1295 (± 1) mm, lautele tulaga: 200-1340m0. Atonu e tusa ai ma le tagata faatau talosaga tomai.
PCB Copper Up ata ata

