Ultra Low Profile Copper Foil Mo le 5G High Frequency Board

●Mafiafia: 12um 18um 35um

●Lautele masani: 1290mm, Max.lautele 1340mm;e mafai ona tipi e tusa ai ma le tele o talosaga

●afifi pusa laupapa

Fa'amatalaga Oloa

Faailoga o oloa

O le pepa iila mata, o loʻo i ai le iila iila ma le matua maualalo roughness i itu uma e lua, o loʻo togafitia i le JIMA Copper proprietary micro-roughening process e ausia ai le maualuga o le taula ma faʻapea foʻi ma le matua maualalo le gaʻa.E ofoina atu le maualuga o le faatinoga i le tele o vaega, mai laupapa lolomi lolomi e faʻamuamua meatotino faʻasalalau ma faʻataʻitaʻiga o mamanu lelei i liʻo lolomi fetuutuunai e faʻamuamua le manino.

Vaega

●Fa'amatalaga sili ona maualalo ma le malosi o le pa'u maualuga ma le malosi etch lelei.
●Hyper Low coarsening technology, o le microstructure e avea ma mea sili ona lelei e faʻaoga i le eletise eletise maualuga.
●O le pepa iila ua togafitia e piniki.

Fa'aoga masani

●Fa'asalalauga fa'asalalau maualuga
●Nofoaga fa'avae/Sauva'a
●Fa'akomepiuta maualuga saoasaoa
●PPO/PPE

Meatotino masani ole Ultra Low Profile Copper Foil

Fa'avasegaga		Vaega	Metotia Su'ega			To Metotia
Nominal mafiafia		Um	12	18	35	IPC-4562A
Mamafa o le Eria		g/m²	107±5	153±7	285±10	IPC-TM-650 2.2.12.2
Mama		%	≥99.8			IPC-TM-650 2.3.15
Talatala	Itu iila (Ra)	m	≤0.43	≤0.43	≤0.43	IPC-TM-650 2.3.17
Talatala	Itu ma'i (Rz)	um	1.5-2.0	1.5-2.0	1.5-2.0
Malosi Tetele	RT(23°C)	Mpa	≥300	≥300	≥300	IPC-TM-650 2.4.18
Malosi Tetele	HT(180°C)	Mpa	≥180	≥180	≥180
Fa'aumiumi	RT(23°C)	%	≥5	≥6	≥8	IPC-TM-650 2.4.18
Fa'aumiumi	HT(180°C)	%	≥6	≥6	≥6
Pinholes & Porosity		Numera	No			IPC-TM-650 2.1.2
PTuna Malosi		N/mm	≥0.6	≥0.8	≥1.0	IPC-TM-650 2.4.8
PTuna Malosi		Lbs/in	≥3.4	≥4.6	≥5.7	IPC-TM-650 2.4.8
Anti-oxidization	RT(23°C)	Aso	90
Anti-oxidization	RT(200°C)	minute	40